Advancing in Adhesion, Surface Energy and Barrier
High metal adhesion
- Eliminates the need for chemically treated films
- High bonding strength achieved on any substrate, adhesion values of up to 5N/15mm
- Safeguards barrier properties in the laminate structure to provide required shelf life.
High dyne level retention
- Improved ink wettability during printing
- Enhances structure stability during lamination
- Can eliminate need for additional surface treatment.
Enhanced barrier on BOPP and CPP films
- Enhancement of oxygen and water vapour barrier levels
- More stable and less corrosion sensitive metallized layer.
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Suitable for the following industries
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