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BOBST at LabelExpo Chicago: Missed It? Watch the Highlights and Join Us in December!

LabelExpo Chicago was a fantastic opportunity for BOBST to showcase its latest innovations that are set to redefine the packaging industry.

Focused on connectivity, automation, and sustainability, our solutions are built to help companies stay competitive and drive growth in today’s fast-paced market.

For those who couldn’t attend, we’ve captured the key moments from the event, including exclusive interviews with our technology experts. In these interviews, our experts share their insights on how BOBST’s solutions—like BOBST Connect and our advanced printing technologies—are enabling customers to achieve higher efficiency, better quality, and greater sustainability.

Want to see more?

Join Us for Our Label and Flexible Packaging Open House!
If you’re interested in seeing our innovations live, we invite you to attend our Label and Flexible Packaging Open House on Tuesday, December 3. This event will be a great opportunity to experience our solutions up close, meet with BOBST experts, and learn how our technologies can help you optimize your packaging operations.

Date: Tuesday, December 3
Location: Atlanta Competence Center

Book your place now 

Don’t miss out on the chance to be a part of this exciting event and see the future of packaging in action!

BOBST